按照玉米淀粉的表觀結構、孔徑結構、止水塞結構以及原子分子結構這4個不同的結構層級，對高靜壓作用下玉米淀粉上述結構層級的具體變化規律進行了研究。進而利用立方氧化鋯和拉曼光譜聯用技術，對高靜壓作用下玉米淀粉顆粒結構變化進行了原位檢測，探討分析了結構變化的主要規律。

According to the four different structural levels of corn starch, namely, apparent structure, pore structure, water stop structure and atomic and molecular structure, the specific changes of the above structural levels of corn starch under high hydrostatic pressure were studied. Furthermore, the structure changes of corn starch granules under high hydrostatic pressure were detected in situ by using cubic zirconia and raman spectroscopy.

(1)利用掃描電子顯微鏡研究了玉米淀粉顆粒表觀結構變化。當淀粉濃度保持一定時，隨著壓力的增加，顆粒表面孔洞結構數量增加、孔洞直徑增大、淀粉顆粒向凹陷。壓力增大到450MPa或者淀粉濃度增大到30%以上，淀粉顆粒開始膨脹糊化。

(1) The changes of the apparent structure of corn starch granules were studied by scanning electron microscopy. When the starch concentration is kept constant, with the increase of pressure, the number of pore structures on the surface of the granules increases, the diameter of the pores increases, and the starch granules sag toward the center. When the pressure increases to 450MPa or the starch concentration increases to more than 30%, the starch granules begin to expand and gelatinize.

(2)通過透射電子顯微鏡研究了玉米淀粉內部孔徑結構變化。淀粉顆粒結構破壞均從內部開始。隨著壓力增大和淀粉濃度提高，淀粉內部孔徑結構變多，孔道加長，直徑增加。淀粉顆粒糊化程度越來越高。淀粉顆粒孔徑結構改變所需要的臨界壓力值不斷減小。

(2) The changes of the inner pore structure of corn starch were studied by transmission electron microscopy. The starch granule structure was destroyed from the inside. With the increase of pressure and starch concentration, the internal pore structure of starch becomes more, the pore channel is longer, and the diameter increases. The gelatinization degree of starch granules is getting higher and higher. The critical pressure value required for the change of the pore size structure of starch granules is decreasing.

(3)利用場發射掃描電子顯微鏡研究了玉米淀粉止水塞結構變化。隨著高靜壓力以及淀粉濃度的升高，缺陷型止水塞結構先增加后減少，止水塞結構從單個突出于顆粒表面先聚集成更大的結構集團并隨著條件變化重又消失。這種結構的轉變是支鏈淀粉結晶簇之間的相互交聯作用不斷變化造成的。

(3) The structural changes of corn starch water stop plug were studied by field emission scanning electron microscope. With the increase of high static pressure and starch concentration, the structure of defective water stop plug first increases and then decreases. The water stop plug structure first aggregates into larger structural groups from a single one protruding from the particle surface and then disappears again with the change of conditions. This structural change is caused by the continuous change of the cross-linking between amylopectin crystal clusters.

(4)利用傅立葉變換紅外光譜對玉米淀粉特征官能團的變化研究表明，淀粉濃度一定，壓力變化時，600MPa條件下O-H伸縮振動、C-OH鍵伸縮振動情況、端基C彎曲振動、C-H面外彎曲振動以及C-O六元環呼吸振動強度弱；壓力不變，淀粉濃度變化時，淀粉濃度對端基C彎曲振動不能產生顯著的影響。

(4) The study on the change of characteristic functional groups of corn starch by Fourier transform infrared spectroscopy showed that the intensity of O-H stretching vibration, C-OH bond stretching vibration, C-H end group bending vibration, C-H out of plane bending vibration and C-O six membered ring respiratory vibration was weak at 600MPa when the starch concentration was constant and the pressure was changed; When the pressure is constant and the starch concentration changes, the starch concentration has no significant effect on the bending vibration of terminal C.

(5)利用立方氧化鋯對頂砧與拉曼光譜聯用技術研究了玉米淀粉分子結構在加壓過程中的拉曼光譜變化。

(5) The molecular structure of corn starch under pressure was studied by Raman spectroscopy coupled with cubic zirconia anvil.

實驗證明淀粉分子對壓力的作用敏感。C-O-C鍵在淀粉分子中相對于其他化學鍵對壓力作用反應為遲鈍。加壓過程中化學鍵拉曼位移變化趨勢不一致的現象表明壓力作用造成空間不對稱的葡萄糖單體分子中不同化學鍵同時發生了不同方向的扭轉、壓縮與拉伸。關于此方面的疑惑或者需求可以隨時來我們網站http://tecnoleo.com進行咨詢！

The experiment proved that starch molecules are sensitive to pressure. C-O-C bond in starch molecule is relatively insensitive to pressure action compared with other chemical bonds. The phenomenon that the Raman shifts of chemical bonds are not consistent during the pressurization process indicates that different chemical bonds in the glucose monomer molecules with spatial asymmetry caused by the pressure simultaneously twist, compress and stretch in different directions. You can come to our website at any time for any doubts or needs in this regard http://tecnoleo.com Consult!